0dc9daf54f
- gen_bom.py + BOM_board.csv: authoritative BOM generated from board.net (70 line items, 167 placements), grouped with MPNs; refs match the integrated netlist; DNP ICs flagged. (Supersedes the early hand-written BOM.csv, which used per-block refs.) - LAYOUT.md: routing rulebook for board.net -- 4-layer stackup, the grounding/star-point strategy, switcher loop isolation, analog separation, USB diff pair, RP2350/crystal/flash, thermal, DNP blocks, pre-fab confirm list, DRC checklist. - pcb_layout_tutorial.md: beginner orientation -- use KiCad; the schematic/netlist=contract vs layout=physical-realization paradigm; the import->place->route->pour->DRC->Gerber workflow; vocabulary; how our files fit; learning resources; honest expectations. Co-Authored-By: Claude Opus 4.8 (1M context) <noreply@anthropic.com>
108 lines
6.5 KiB
Markdown
108 lines
6.5 KiB
Markdown
# PM_K-1 Core Board — PCB Layout Guide
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The rulebook for turning `hardware/kicad/board.net` (167 components) into a routed board.
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Read alongside `pcb_layout_tutorial.md` (how the tool works) and `DESIGN.md` (why the
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circuit is shaped this way). This is a mixed-signal board — a switching supply, sensitive
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±15 V analog, a fast MCU, and USB all on one PCB — so **layout discipline matters more than
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on a simple digital board.** The schematic is done and verified; good layout is now what
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makes it actually perform.
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## 1. Stackup — use 4 layers
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A 2-layer board will work electrically but will be noisy. Use **4 layers**:
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```
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L1 signal + components (top)
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L2 GROUND plane (solid) <- the single most important thing for noise
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L3 power (3V3 / +5 / ±15 split zones)
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L4 signal + components (bottom)
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```
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A solid ground plane directly under the signal layer gives every fast/analog trace a clean
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return path. **Do not cut the L2 ground plane up** (one exception: the star-point, below).
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Finish: **ENIG (gold)** — heirloom requirement.
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## 2. Grounding — the heart of a mixed-signal board
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There are three "kinds" of ground current that must not share copper:
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- **Switcher ground** — the TPS65131 boost/inverter pumps current in sharp pulses. Dirty.
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- **Digital ground** — RP2350, flash, USB. Medium.
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- **Analog ground** — the ±15 V audio section (THAT/OPA, DAC). Must stay quiet.
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**Strategy:** one solid ground plane (L2), but *partition by placement* — put the switcher
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in one corner, digital in another, analog in a third, so each section's return currents stay
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local and don't flow under another section. Join them at a **single star point** near the
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main ground entry. Keep the switcher's high-current loop entirely in its corner.
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- `AGND` (analog signal ground) and `CHASSIS` (shield) meet **only** through the ground-lift
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relay K3 + its 100 Ω∥10 nF soft-lift — keep those two nodes otherwise separate.
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- The DAC datasheet rule: AGND/DGND/CPGND within 0.2 V of each other — tie them at the star.
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## 3. Switching supply (TPS65131) — most layout-critical block
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Switchers fail in *layout*, not schematic. Keep these loops physically tiny:
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- **Input caps** (C1/C2, 4.7 µF) right at the INP/INN pins.
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- **Inductors L1/L2 (4.7 µH)** and **Schottkys D1/D2 (MBRM120)** close to the switch nodes
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(`SW_BOOST`, `SW_INV`) — these nodes are the noisiest copper on the board; keep them **small
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and away from everything analog**. Don't run any audio or USB trace near them.
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- **Output caps** (C4/C5, 22 µF) close to VPOS/VNEG.
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- **Feedback dividers** (R1/R2, R3/R4) and `VREF` (C8) routed quietly, away from the switch nodes.
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- Then the **±15 V LDOs** (TPS7A49/30) take the raw ±18 V to clean rails — place them between
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the switcher and the analog section so the clean rails enter analog, not the raw ones.
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## 4. Analog audio section — keep it quiet and far
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- Place the whole audio chain (THAT1240/1646, OPA1641/1612, DAC, relays) **as a group**, far
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from the switcher and the digital ribbon.
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- **No analog audio trace runs parallel to the fast SPI or the switch nodes** (this is why
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the analog interconnect J3 is physically separate from the digital ribbon J2).
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- Film coupling caps and 0.1 % resistors in the signal path; keep signal traces short.
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- The balanced in/out: route HOT/COLD as a **tight pair** so noise hits both equally (that's
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what the receiver's CMRR rejects). The `MUTE` (K2) and `GND-LIFT` (K3) relays near the output.
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- The level-cal trimmer **RV1** must be reachable with a screwdriver after assembly.
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## 5. RP2350 core (per RP "Hardware design with RP2350")
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- **QSPI flash** (U?) traces to the RP2350 **short and direct** — high-frequency bus.
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- **12 MHz crystal** tight to XIN/XOUT, with its own local ground; a guard ring helps; keep
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fast signals away from underneath it.
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- **Core SMPS**: the 3.3 µH inductor loop (VREG_LX → DVDD) small; 100 nF per power pin, placed
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right at each pin.
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- **BOOTSEL** (R6 1 k + button) and the flash-CS resistors close to the flash.
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## 6. USB
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- `D+`/`D-` (`USB_DP_CONN`/`USB_DM_CONN`) routed as a **90 Ω differential pair**: short,
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length-matched, same layer, reference the ground plane, no stubs.
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- The **USBLC6-2 ESD** and the **27 Ω series resistors** right at the connector, before the pair.
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- CC 5.1 k pulldowns near the connector. USB-C shell to chassis.
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## 7. The two interconnects (the modular split)
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- **J2 digital ribbon** (Pico-pinout) and **J3 analog** (balanced audio + speaker) are on
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separate connectors *on purpose* — keep them physically apart on the board and in the
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cabling. Interleave grounds on the digital ribbon for the SPI return.
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- **J4 MIDI** only matters if the DNP MIDI block is fitted.
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## 8. Mechanical & fab
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- 4× M3 mounting holes with keep-outs; a chassis-ground pad.
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- **USB-C connector with through-hole anchor tabs** (SMD-only tabs shear off — unacceptable
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for a 50-year device). Connector strain relief lives on the face/enclosure.
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- Shrouded/keyed/latching interconnect headers.
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- **4-layer, ENIG**, controlled impedance on the USB pair. Optional conformal coat for humidity.
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## 9. Thermal
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- The ±15 V LDOs dissipate (Vin−Vout)×I ≈ (18−15)×~30 mA ≈ 90 mW each — small, but give them
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copper pour / the PowerPAD to the plane.
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- The TPS65131 thermal pad to the ground plane with vias.
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## 10. Do-not-populate (DNP) blocks
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Per form factor, these are optional — leave the footprints, populate per build:
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- **MIDI** (U?/H11L1 opto + 74LVC14 buffer + its resistors)
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- **SIG/CLIP indicator** (LM393 + peak-detect parts)
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- **monitor speaker amp** (PAM8302A + its caps/resistors)
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The BOM flags the DNP *ICs*; their surrounding passives are DNP too when the block is unfitted.
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## 11. Pre-fab confirm list (flagged during capture)
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- Footprints: RV-8803-C7, the QFN variants (RP2350A/TPS65131), USB-C (24-pin symbol vs the
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16-pin GCT USB4085 part — pick one), the relay TQ2-SA.
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- Values: LDO V_FB exact (used 1.194 V / −1.18 V for the dividers); crystal load caps (~15 pF
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per the chosen crystal); 3.3 V-MIDI series-R values.
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- Confirm: H11L1 pinout (standard; datasheet fetch had timed out); PCM5102A MCLK-less = SCK→GND.
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## 12. Final checks before Gerbers
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1. **DRC clean** (clearances, track widths, the diff-pair rules).
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2. Re-import the netlist and confirm no unrouted nets (ratsnest empty).
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3. Verify the switcher loops are tight and isolated; analog has no switch-node neighbors.
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4. Confirm the ground star point and the analog/digital partition.
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5. Generate Gerbers + drill + pick-and-place + the BOM (`BOM_board.csv`) for the fab.
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